Nationally recognized program reshapes the way students experience education
The Missouri Innovation Campus (MIC), a progressive collaboration between the Lee’s Summit R-7 School District, Metropolitan Community College and the University of Central Missouri has begun work on the initiative’s fourth program, Cyber Security.
During July, more than 20 cyber security professionals from 11 regional companies worked with instructors from Summit Technology Academy, MCC and UCM to identify industry standard cyber security competencies that will drive the MIC new program. The Cyber Security program will begin in June 2016.
Other Missouri Innovation campus programs are System Engineering Technology, Design and Drafting and Software Development/Programming. Through the Missouri Innovation Campus, located within Lee’s Summit R-7’s Summit Technology Academy and UCM, students are able to accelerate the time it takes to graduate from college and participate in high-tech paid internships while dramatically reducing the cost of a four-year program. For more information about the school, visit the UCM website or R-7 website.
Thanks to a no-tax-increase bond issue, Summit Tech / MIC will have a new home by August 2017. The $40 million bond issue, approved by approximately 80 percent of voters, is funding a new school for the programs as well as facility improvements at all Lee’s Summit R-7 schools. For more information about the bond issue, visit our bond progress website.